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CAD Design Software
We are the Austria, Switzerland, Eastern Europe and Israel distributor of CAD Design Software.
CAD Design Software produces EDA layout software that utilizes advanced 2D and 3D graphics. EPD, also known as Electronics Package Designer, is the core design engine in all of CAD Design Software's design suites and utilizes the industry-standard AutoCAD© graphics engine. Currently, we only do support AutoCAD 2004 or newer versions, but we also have a Windows version with built-in AutoCAD graphics engine. Each suite is tailored for specific technologies and industries. The result is faster, more accurate designs than are possible with other "Design Automation" tools.
CAD Design Software is used by market and leading-edge technology leaders in the following industries:
- BGA packages (all types, including PBGA, enhanced BGA, PGA, and FlexBGA)
- Chip Scale (including μBGA and wafer scale)
- Stacked die and stacked substrate packages
- Build-up Substrates (HDI, HDS)
- Leadframe
- Hybrid/MCM (including ceramic, thick film and thin film, LTCC, etc.)
- Load, Probe, and Burn-in Boards
- RF/Microwave/Wireless
- Analog, Digital, and Flex PCB
- Schematics
- Gerber and GDSII bi-directional conversions
IC Packaging:
    
 
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IC Test:
 
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Hybrid / MCM:
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RF / PCB Design:
   
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Please contact us for more details about our other tools of CAD Design Software. Please also look at our newly designed feature demos and video demos.
CAD Design Software offers a complete line of products directed toward specific designs. Each of our Design Suites includes layout tools, checking utilities and film conversion software. The Utilities products are sets of tools that are included with many of the Design Suites. Most Utilities can be added to a Suite to extend its functionality. Our Stand-Alone products do not require a design suite to operate and are for specific needs such as film conversion or schematics.
We have the following Designer Suites:

PCB, Flex, Hybrid, RF and all board level designs are implemented with the Master PCB Designer Suite.

IC Test design needs like ProbeCard, LoadBoard and BurnIn Boards and all other IC test are achieved with the Master IC Test Designer Suite.

Packaging, Stacked Die, Flipchip, Leadframe, SiP, PoP, SoC, and Chip Scale design solutions are just part of what you can design with the Master Foundry Designer Suite.
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